Andes offers a broad portfolio of 30+ silicon-proven processor IP cores, spanning compact 32-bit MCUs to high-performance ...

3. Industrial IoT Adapters: If the equipment has basic control panels or analog outputs, you can use adapters, like OPC-UA converters or Modbus-to-IoT bridges, to digitize that data and send it out.

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

For NXP, this evaluation reflects a proactive approach to securing embedded systems against future threats. For Keysight, it underscores the company’s role in helping technology leaders build ...

The CC EAL6 certification is conducted based on the international information protection standards ISO/IEC 15408 and 18045, covering the product lifecycle from planning and design stages to final ...

Ansys and SASTRA Deemed University Establish Center of Excellence for Advanced Space and Defense Technologies. Jul. 22, 2025 – Ansys, now part of Synopsys, to ...

A new report now claims that Samsung rejected three proposals made by Nvidia CEO Jensen Huang in 2018. The proposals were reportedly about joint HBM production, cooperation on Samsung Foundry to ...

The Automotive SerDes Alliance was formed to standardize SerDes connectivity for automotive applications. ASA is a non-profit industry alliance of automotive industry and technology providers ...

Siemens Digital Industries Software announced today that it has collaborated with United Microelectronics Corporation (UMC), a leading global semiconductor foundry, to implement Siemens' mPower™ ...

In fact, these academic-industry collaborations have deep roots, dating back to the 1940s. At Purdue University, physicist Karl Lark-Horovitz led pioneering work on germanium crystals, advancing ...

Sustainability in Action 2025 is a strategic document that outlines concrete plans and measurable targets that reflect Leonardo's commitment to shape a responsible and resilient business model.

Researchers at Forschungszentrum Jülich and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a material that did not exist before: a stable alloy of carbon, silicon, ...